As printing companies seek the best ways to reduce costs, increase productivity and capture new market opportunities, many of them are getting educated on the advanced, integrated capabilities from Electronics For Imaging, Inc. presented at the 19th annual EFI Connect conference.

FESPA Asia has released details of its conference programme ahead of the event taking place at the BITEC exhibition centre in Bangkok, Thailand, from 22-24 February 2018.

Against the backdrop of an increased consumer gravitation towards greener options, the Antalis Academy is preparing to hold its first breakfast seminar of the year, specifically around the growing topic of sustainability and what it means for the industry.

Electronics For Imaging, Inc. has expanded the speaker lineup for its users' conference, EFI Connect 2018 (Jan. 23-26 at Wynn Las Vegas).

This year at the Packaging Innovations exhibition at the NEC, AG/CAD will be showcasing an integrated superfast DYSS X5 Digital Cutter, Auto Sheet feeder and KASEMAKE software solution for design, sampling, prototyping and short run production.