17 Jan 2022
A new ‘OK Compost’ certified label material for thermal applications from Avery Dennison.

New 'OK Compost' certified label material from Avery Dennison

Avery Dennison has successfully achieved OK Compost certification for a BPA-free and FSC-certified thermal label material combined with the brand new adhesive SX6030, offering brands new options to more sustainable packaging.

BOBST unveils a new vision for the packaging industry and launches a new range of machines and solutions.

BOBST unveils a new vision for the packaging industry

The BOBST vision is shaping a new reality where connectivity, digitalization, automation and sustainability are the cornerstones of packaging production.

Labmak became the beta test site for the Durst RSC platform three years ago, working in partnership with Durst.

The Label Makers wins new business with the Durst Tau RSC

Multi-award-winning company The Label Makers has expanded into higher-end markets and turned a major food brand prospect into one of its biggest accounts, thanks to the Durst Tau RSC platform and software capabilities.

Polish company Digit Pack invests in EFI Nozomi C18000.

Polish company Digit Pack invests in EFI Nozomi C18000

Digit Pack, a relatively new company in the corrugated sector in Poland, has invested in the EFI Nozomi C18000 six-colour, single-pass LED inkjet printer from Electronics For Imaging, Inc.

Wegner GmbH reaps productivity and versatility benefits with Fujifilm’s Jet Press 750S.

Wegner GmbH reaps productivity with Fujifilms Jet Press 750S

Long-standing Fujifilm customer, Wegner GmbH in northern Germany, has seen an increase in output, production speeds and flexibility following its investment in Fujifilm’s Jet Press 750S.

Superfast Labels partners with Konica Minolta to enhance digital print capacity.

Superfast Labels expand with Konica Minolta AccurioLabel 230

Kent-based Superfast Labels has chosen the AccurioLabel 230 toner press from Konica Minolta to bolster its digital armoury. The new press will enable the company to address increasingly shorter lead times and further boost its efficiencies.